Co-curable with prepreg and SPRINT™ systems at 70°C and above
¬ Ideal for core splicing and gap filling
¬ Convenient 300ml cartridge format
INTRODUCTION
MP75-90 is a single component epoxy system designed to co-cure at moderate elevated
temperatures with Gurit epoxy prepregs and SPRINTs™. It is a thixotropic paste ideal for
any gap filling or core splicing operations during the layup of prepreg or SPRINT ™ . The
colour is dark grey to tone in with carbon prepregs
INSTRUCTIONS FOR USE
MIXING AND HANDLING
MP75-90 is a pre-catalysed mono-component system and therefore does not need to be mixed with a hardener component. The resin
requires a temperature of 70°C to cure but some polymerisation can occur at room temperature. This will thicken the product and affect
its handling properties, to ensure safe use the product should not be left for extended period at room temperatures or any time above
40°C.
APPLICATION
The adhering surfaces should be dry, free of grease, oil, or mould release or similar material which would prevent adhesion of the system.
The product can be applied directly from cartridge with a standard mastic gun and spread if necessary with a pallet knife or spreader.
MP75-90 is sag resistant up to 25mm in thickness on a vertical surface and retains thixotropy even at elevated temperatures.
MP75-90 can be used to fill gaps or tight radius corners in prepreg or SPRINT components. It is also commonly used as a core sheet
edge splicing adhesive.