With low weight and short strokes/quick tool lifts, this module offers very high cutting speeds. The module also impresses with simple operation, rapid tool changes, and very high precision.
Depending on the application, you can choose between two different processing modes: in pressure mode, the module exerts constant pressure, adjustable from 30 to 1,500 grams, on the substrate. This results in precise, clean cuts in e.g. pressure-sensitive vinyl without damage to the liner material. In position mode, the tool through-cuts the material at a pre-set depth.
Kiss-cutting and through-cutting of all commonly used vinyls, films, etc.
Clean, precise cutting of self-adhesive vinyl without damage to liner
Compatible with S3
The Kiss-cut Module cuts self-adhesive vinyls and materials with a thickness of up to 1.5 mm. The high processing speed and the very high precision when cutting smaller contours are outstanding.
The KCM-S is a further development of the tried and tested C2 tool head. The low weight
and short stroke movements promise very high processing speeds. The module also impresses through its simple operation, fast tool changing and very high precision.
Depending on the intended use, there are two different processing modes that can be chosen:
In pressure mode, the module exerts a constant, very finely adjustable pressure of
between 30-1600 grams on the processing material. Cover layers of self-adhesive vinyls
are separated precisely without damaging the base material.
In position mode, the tool is lowered to the set depth and the material is cut through completely.